Shenzhen Okey Circuit Co., Ltd.  

Product Name: Professional High Quality SMT PCB Assembly and PCBA Model NO.: Okey-am-080 Material: Fr4 Mechanical Rigid: Rigid Application: Consumer Electronics Processing Technology: Electrolytic Foil Insulation Materials: Organic Resin base Material: Aluminum Dielectric: FR-4 Flame Retardant Properties: V0 Type: Rigid Circuit Board Color: Green, Blue, Black, Red, Yellow etc. Trademark: OKEY Transport Package: Inner Vacuum Packed Outside in Carton Specification: UL ISO RoHS, REACH Origin: Guangdong Shenzhen, China HS Code: 8534009000 Product Description Technical CapabilitiesItemsSpeci.RemarkMax panel size32" x 20.5"(800mm x 520mm)Max. Board size2000×610mmMin. board Thickness2-layer 0.15mm4-layer 0.4mm6-layer 0.6mm8-layer 1.5mm10-layer 1.6~2.0mmMin. line Width/Space0.1mm(4mil)Max. Copper thickness10OZMin. S/M Pitch0.1mm(4mil)Min. hole size0.2mm(8mil)Hole dia. Tolerance (PTH)±0.05mm(2mil)Hole dia. Tolerance,+0/-0.05mm(2mil)Hole position deviation±0.05mm(2mil)Outline tolerance±0.10mm(4mil)Twist & Bent0.75%Insulation Resistance>10 12 Ω NormalElectric strength>1.3kv/mmS/M abrasion>6HThermal stress288°C 10SecTest Voltage50-300VMin. blind/buried via0.15mm (6mil)Surface FinishedHASL, ENIG, ImAg, Imsn OSP, Plating AG, Plating goldMaterialsFR4,H-TG,Teflon,Rogers,Ceramics,Aluminium, Copper baseMin trace width/ space (inner layer)4mil/4mil(0.1mm/0.1mm)Min PAD (inner layer)5 mil(0.13mm)hole ring widthMin thickness(inner layer)4 mil(0.1mm)without copperInner copper thickness1~4 ozOuter copper thickness0.5~6 ozFinished board thickness0.4-3.2 mmBoard thickness tolerance control±0.10 mm±0.10 mm1~4 L±10%±10%6~8 L±10%±10%≥10 LInner layer treatmentbrown oxidationLayer count Capability1-30 LAYERalignment between ML±2milMin drilling0.15 mmMin finished hole0.1 mmHole precision±2 mil(±50 um)tolerance for Slot±3 mil(±75 um)tolerance for PTH±3 mil(±75um)tolerance for NPTH±2mil(±50um)Max Aspect Ratio for PTH08:01Hole wall copper thickness15-50umAlignment of outer layers4mil/4milMin trace width/space for outer layer4mil/4milTolerance of Etching+/-10%Thickness of solder maskon trace0.4-1.2mil(10-30um)at trace corner≥0.2mil(5um)On base material≤+1.2milFinished thicknessHardness of solder mask6HAlignment of solder mask film±2mil(+/-50um)Min width of solder mask bridge4mil(100um)Max hole with solder plug0.5mmSurface finishHAL (Lead or Lead free), immersion Gold, Immersion Nickel, Electric Gold finger,Electric Gold, OSP, Immersion Silver.Max Nickel thickness for Gold finger280u"(7um)Max gold thickness for Gold finger30u"(0.75um)Nickel thickness in Immersion Gold120u"/240u"(3um/6um)Gold thickness in Immersion Gold2u"/6u"(0.05um/0.15um)Impedance control and its tolerance50±10%,75±10%,100±10% 110±10%Trace Anti-stripped strength≥61B/in(≥107g/mm)bow and twist0.75%Double sided PCB board with OSP finish:Place of Origin Guangdong, China (Mainland)Brand Name OKEYModel Number okey PCBbase Material FR-4Copper Thickness 1 OZBoard Thickness 1.2 mmMin. Hole Size 0.4mmMin. Line Width 0.2mmMin. Line Spacing 0.15mmSurface Finishing HASLColor redSmall order acceptableFire resistanceUL-94V0Outline/contourmilling, V-cut, CNC Routing100% productsE-test or flying probe testFeaturesThin board capabilitiesIncrease routing density in complicated desigExcellent mounting stability and reliabilityQualified material and surface treatment for Lead-free processApplicationsSmartphone, Feature Phone, Tablet, Ultrabook, e-Reader, MP3 Player, GPS, Portable Game Console, DSC, Camcorder, LCD ModuleBenefitsWell experienced manufacturer with good yielMultiple plants increase production output in short timeNOItemTechnical capabilities1Layers1-20 layers2Max. Board size2000×610mm3Min. board Thickness2-layer 0.15mm4-layer 0.4mm6-layer 0.6mm8-layer 1.5mm10-layer 1.6~2.0mm4Min. line Width/Space0.1mm(4mil)5Max. Copper thickness10OZ6Min. S/M Pitch0.1mm(4mil)7Min. hole size0.2mm(8mil)8Hole dia. Tolerance (PTH)±0.05mm(2mil)9Hole dia. Tolerance (NPTH)+0/-0.05mm(2mil)10Hole position deviation±0.05mm(2mil)11Outline tolerance±0.10mm(4mil)12Twist & Bent0.75%13Insulation Resistance>10 12 Ω Normal14Electric strength>1.3kv/mm15S/M abrasion>6H16Thermal stress288°C 10Sec17Test Voltage50-300V18Min. blind/buried via0.15mm (6mil)19Surface FinishedHAL, ENIG, ImAg, Imsn OSP, Plating AG, Plating gold20MaterialsFR4,H-TG,Teflon,Rogers,Ceramics,Aluminium, Copper base